GF-02 Thermal Gel(Silicon-Free)

Product Introduction

GF-02 Thermal Gel is an extremely soft, high thermal conductivity thermal interface material designed for advanced electronic thermal management applications. Compared with traditional thermal grease and phase-change materials, it features a lightly crosslinked structure that significantly reduces volatility and material migration.

With a thermal conductivity of up to 6.5 W/m·K, GF-02 provides efficient heat dissipation performance while maintaining excellent mechanical compliance. Its ultra-soft gel structure allows large deformation under pressure, ensuring close contact between heat sources and heat sinks for improved thermal transfer efficiency.

The product is non-silicone based and contains no silicone oil, eliminating the risk of silicone oil precipitation and contamination. It also demonstrates strong creep resistance, permanent adhesion characteristics, and no leakage or spillage during long-term operation. Additionally, it offers high dielectric strength up to 10 KV/mm, making it suitable for demanding electronic environments.

Product Features

High thermal conductivity up to 6.5 W/m·K
Silicon-free formulation, no silicone oil migration
Extremely soft and highly deformable gel structure
Low volatility and reduced material spillage
Strong long-term adhesion performance
Excellent creep resistance
High dielectric breakdown strength up to 10 KV/mm
Stable performance under wide temperature range

Product Parameters

Color: Light blue

Flow Rate (30cc EFD cartridges, 0.100” orifice, 90psi): 30–35 g/min

Specific Gravity: 3.0 ± 0.1 g/cm³

Volume Resistivity: >10¹¹ Ω·cm

Thermal Conductivity: 6.5 W/m·K

Breakdown Voltage: >10 KV/mm

Low Limit BLT Thickness: 0.09 mm

Operating Temperature Range: -50°C to 280°C

Shelf Life: 12 months

Siloxane Volatiles (D4–D20): 0%

Coefficient of Thermal Expansion: 180 ppm/K

Flammability Rating: UL94 V-0

Application Areas

GF-02 Thermal Gel is suitable for high-performance thermal management in electronic devices, including:
Power electronics modules
Communication equipment
LED systems
Automotive electronics
High-power semiconductor devices
Industrial control systems